Fan-Out Wafer Level Packaging Patent Landscape

The number of enforceable patents is increasing worldwide, with several companies already standing out by virtue of their strong IP position. KEY FEATURES OF THE REPORT – IP trends, including time evolutions and countries of patent filings – Patents’ current legal status – Ranking of main patent applicants – IP collaboration, joint development, and licensing agreements – Key players’ IP position, and relative strength of their patent portfolios – Patent segmentation by technology solution , process steps , architecture , and technical challenge – Matrix showing patent applicants and their patented technologies – Technical solutions found in patents for warpage and die-shift issues.